ZVT-PRINT a.s.

Banská Bystrica

Products
Materials
Capabilities
Specifications
Surface
Solder resist
Screen printing
Treatment
Testing

Products

Nowadays ZVT-PRINT a.s. specializes in single sided, double sided and multilayer PCB production in quick-turn job with very small volume, prototype volume ( POOL panels - more PCB types in one panel; also possible ), in small and medium volume.


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Base Material Types

Material Standard thickness in mm
Single + double-sided Cu plating FR 4 0.4; 0.6; 0.8; 1.0; 1.2; 1.55; 2.0; 2.4; 3.0; 3.2;
Material for multi-layer PCB FR 4 ML

Before ordering of uncommon type of material, please contact us to check our material stocks!


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Production capabilities

Maximum dimensions of PCB 365 x 505 mm, ML 236 x 396 mm
Maximum thickness of PCB 3.2 mm
Minimum thickness of PCB 0.4 mm
Minimum drilled hole ø 0.3 mm ; final plated through ø 0.2 mm
Aspect ratio 1:4
Tolerance of plated through holes ø ≤ 2.0 mm: +/- 0.10 mm
2.0 mm < ø ≤ 5.3 mm: +/- 0.15 mm
ø > 5.3 mm: +/- 0.20 mm
Maximum number of layers 6

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Technical specifications

Conductor width [conductive pattern on outer layer of PCB]

Copper thickness Min. conductor width Min. annular width Final conductor tolerance
/µm/ /mm/ /mm/ /mm/
18 0.15 0.15 + 0.02 - 0.05
35 0.20 0.20 + 0.03 - 0.08
70 0.30 0.30 + 0.03 - 0.12

Conductor spacing [conductive pattern on outer layer]

Copper thickness Minimum distance between conductors Final tolerance of distance between conductors
/µm/ /mm/ /mm/
18 0.15 + 0.05 - 0.02
35 0.20 + 0.08 - 0.02
70 0.25 + 0.12 - 0.03

Inner layer conductive pattern - multi-layer PCB

Inner layer plating : Cu 35/35
Minimum /mm/
Distance between conductors 0.20
Conductor width 0.20
Annular ring 0.23

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Surface treatment

Pbfree surface treatment

HAL Pbfree:
thickness: 2 - 40 µm

Immersion tin (chemical):
thickness: 0.8 - 1.2 µm

chemical Ni/Au:
thickness Au: 0.1 µm


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Solder resist

Addition to diameter of soldering pad: 0.10 mm
Addition to diameter of SMD pad: 0.10 mm
Min. width solder resist: 0.15 mm
Color standard on request
green black, red, blue, white

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Screen printing

Legend

Minimum font width: 0.15 mm

Peelable protective mask

Hole covering Maximum diameter: 2.0 mm
Solder pad covering Addition to soldering pad diammeter: 0.4 mm
Distance between protective mask and pad Minimum: ≥ 0.6 mm
Distance between prot. mask and PCB edge Minimum: ≥ 0.6 mm

Carbon print

Conductor width Minimum 0.4 mm
Clearance width (isolation gap) Minimum 0.4 mm
Contact pad coverage Minimum 0.1 mm addition to the pad edge

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Final treatment

V-cut
routing


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Output control

Testing

Electrical test
Flying Probe Tester

ATG A5
MANIA - SPEEDY 580


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RoHS directive
Restriction of Hazardous
Substances
- HAL Pb free -
- immersion tin -
- chemical Ni/Au -
- flying probe tester -